Theory:
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Adhesion of the tapes can be substantially decreased with heating, allowing easy peeling without stress.
Application:
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MLCC cutting process
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LED chip grinding process
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Glass cutting process
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Chip/Component dicing process
Feature:
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Make for semiconductor device, electronic component, optoelectronics, LED, MLCC component cutting or grinding process.
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Qualities have been certificated by international leading companies.
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Excellent adhesion, no position shift when cutting tiny components.
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Electronic components are easily release from tape after heating by hot plate or oven.
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It shows excellent performance and stability in MLCC & others electronic component manufacturing industry.
Keyword : 熱解膠、熱解膠膜、熱解膠帶、Thermal release tape、Thermal release film、Thermal release tape、熱解黏膠帶
Characteristic:
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