Theory:
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Adhesion of the tapes can be substantially decreased with UV irradiation, allowing easy peeling without stress on the compound.
Application:
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Chip grinding process
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Chip dicing process
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Chip flipping process
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Ceramics cutting process
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Use for temporary fixed purpose
Feature:
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Make for semiconductor device、electronic component、optoelectronics、LED…etc. cutting or grinding process.
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Qualities have been certificated by international leading companies.
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Stabilities can compare to Japan leading companies.
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Special adhesive with excellent adhesion﹐avoid chip loss when cutting.
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Special structure design﹐decrease impacts for blade lifetime.
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Food-grade base material﹐non-toxic﹐soft、smooth and good for pick up.
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After UV irradiation﹐adhesion decreased﹐no any residue.
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Rapid reaction time for UV irradiation﹐it can substantially increase efficiency in your manufacturing process.
Keyword : 光解膠、光解膠膜、光解膠帶、UV tape、UV release film、UV release tape、UV 解黏膠帶
Characteristic:
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