GVC series

Theory:

• Fully protects the products during prcessing and no residual on the products after tape is peeled off.

Application:                                      

• Chip grinding process
• Chip dicing process
• Chip flipping process
• Ceramic cutting process                   

Feature:

• Make for LED、semiconductor device、wafer or chip cutting process.
• Qualities have been certificated by international leading companies.
• Stabilities can compare to Japan leading companies.
• Special adhesive recipe, well-situated adhesion, no any residue.
• Apply to LED chip flipping process, no any chip loss.
• Tape is soft and smooth, good for pick up.

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